Semiconductor Internal Observation Microscope "NIR2021-200"
Equipped with a 1.3 Mega SWIR camera! Ideal for observing metal wiring and die bonding inside the chip.
The "NIR2021-200" is a microscope that utilizes the transmission and reflection characteristics of infrared light to observe the interiors of semiconductor devices such as silicon wafers, chips, MEMS, and CSPs. Equipped with a SWIR camera featuring a 1.3MP Sony IMX990 sensor with a pixel size of 5μm, it allows for the acquisition of high-resolution images despite being in the near-infrared spectrum. The uniquely designed imaging tube and PEIR objective lens series, specifically designed for the highly sensitive near-infrared range of 1100-1700nm, enable the capture of high-contrast images even with thick or high-density wafers. 【Features】 ■ Equipped with a 1.3 Mega SWIR camera ■ Allows internal observation of mounted IC chips that do not transmit visible light ■ Set up with a high-power near-infrared halogen light source ■ Bright images can be obtained even when using a 100x objective lens ■ Equipped with a stage for 8-inch wafers ■ Options such as vibration isolation tables and wafer loaders are also available *For more details, please refer to the PDF document or feel free to contact us.
- Company：清和光学製作所
- Price：Other
